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mESD3.3ST5G SERIES Product Preview ESD Protection Diodes
In Ultra Small SOD-723 Package
The mESD Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size, it is suited for use in cellular phones, MP3 players, digital cameras and many other portable applications where board space comes at a premium.
Specification Features: http://onsemi.com
1 PIN 1. CATHODE 2. ANODE 2
* Small Body Outline Dimensions: * * * * * * * *
0.055 x 0.024 (1.40 mm x 0.60 mm) Low Body Height: 0.020 (0.5 mm) Stand-off Voltage: 3.3 V - 12 V Low Leakage Response Time is Typically < 1 ns ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC61000-4-2 Level 4 ESD Protection IEC61000-4-4 Level 4 EFT Protection These are Pb-Free Devices
MARKING DIAGRAM
L0 M
SOD-723 CASE 509AA L0 M
= Specific Device Code = Date Code
Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic
ORDERING INFORMATION
Device mESDxxST5G Package SOD-723 Shipping 8000/Tape & Reel
Epoxy Meets UL 94 V-0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating IEC 61000-4-2 (ESD) IEC 61000-4-4 (EFT) ESD Voltage Per Human Body Model Per Machine Model PD TJ, Tstg TL Air Contact Symbol Value 30 30 40 16 400 150 -55 to +150 260 Unit kV A kV V mW C C
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking column of the table on page 2 of this data sheet.
Total Power Dissipation on FR-5 Board (Note 1) @ TA = 25C Junction and Storage Temperature Range Lead Solder Temperature - Maximum (10 Second Duration)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. FR-5 = 1.0 x 0.75 x 0.62 in.
This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice.
(c) Semiconductor Components Industries, LLC, 2005
1
September, 2005 - Rev. P1
Publication Order Number: mESD3.3ST5G/D
mESD3.3ST5G SERIES
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted) Symbol IPP VC VRWM IR VBR IT IF VF Ppk C Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Forward Current Forward Voltage @ IF Peak Power Dissipation Max. Capacitance @VR = 0 and f = 1 MHz IPP VC VBR VRWM IR VF IT V IF I
Uni-Directional TVS
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types)
VRWM (V) Max 3.3 5.0 12 IR (mA) @ VRWM Max 2.5 1.0 1.0 VBR (V) @ IT (Note 2) Min 5.0 6.2 13.5 IT mA 1.0 1.0 1.0 C (pF) Typ 90 65 55
Device* mESD3.3ST5G mESD5.0ST5G mESD12ST5G
Device Marking TBD TBD TBD
*Other voltages available upon request. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25C.
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mESD3.3ST5G SERIES
TYPICAL CHARACTERISTICS
BREAKDOWN VOLTAGE (VOLTS) (VZ @ IZ) 7.4 7.3 7.2 7.1 7.0 6.9 6.8 6.7 6.6 6.5 6.4 6.3 -55 + 25 TEMPERATURE (C) + 150 mESDxxST5G IR (nA) 20 18 16 14 12 10 8 6 4 2 0 -55 + 25 TEMPERATURE (C) + 150 mESDxxST5G
Figure 1. Typical Breakdown Voltage versus Temperature
Figure 2. Typical Leakage Current versus Temperature
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mESD3.3ST5G SERIES
PACKAGE DIMENSIONS
SOD-723 CASE 509AA-01 ISSUE O
D
-X- -Y- E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. MILLIMETERS INCHES MIN NOM MAX MIN NOM MAX 0.49 0.52 0.55 0.019 0.020 0.022 0.25 0.28 0.32 0.0098 0.011 0.013 0.08 0.12 0.15 0.0032 0.0047 0.0059 0.95 1.00 1.05 0.037 0.039 0.041 0.55 0.60 0.65 0.022 0.024 0.026 1.35 1.40 1.45 0.053 0.055 0.057 0.15 0.20 0.25 0.006 0.0079 0.010
b
2X
0.08 (0.0032) X Y A
c
L HE
DIM A b c D E HE L
SOLDERING FOOTPRINT*
1.1 0.043 0.45 0.0177
0.50 0.0197
SCALE 10:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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mESD3.3ST5G/D

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